This project is continue research and enhanced from ASIS PCB, Advance Stencil Inspection System in order to achieve new capabilities:
- System able to inspect 1 million apertures, with 1 time scan 8x8 inch wafer disk, by 3200dpi resolution and its accuracy achieve 7um
- System able to inspect 1 million apertures, with 1 time scan 12x12 inch wafer disk, by 2400dpi, resolution and its accuracy achieve 11um
* This project was awarded with entrepreneurship (CIP) grant by CRADLE in year 2008
Research & Developed Prototype In Inspecting Wafer Stencil (Die by Die Inspection) Demonstration:
Green color spot show dust / stain appear on wafer stencil, red color spot shows missing apeature detected.
Due to the wafer stencil surface is dirty, system detect a lot of stain from the image captured. Further research and implementation on hardware and software are required to reduce the errors detection.
Visualization Result On Wafer Map After Inspection Process Completed: